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Volumn 5, Issue 1-3, 1996, Pages 195-202

Simulation of the yield strength of wire drawn Cu-based in-situ composites

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DISLOCATIONS (CRYSTALS); INTERFACES (MATERIALS); MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; NIOBIUM ALLOYS; WIRE DRAWING; YIELD STRESS;

EID: 0030079884     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/0927-0256(95)00072-0     Document Type: Article
Times cited : (20)

References (35)
  • 14
    • 0346272452 scopus 로고
    • eds. S.I. Andersen, J.B. Bilde-Sorensen, T. Lorentzen O.B. Pedersen and N.J. Sorensen. Riso, Denmark
    • D. Raabe and U. Hangen, Proc. 15th Risø Int. Symp., eds. S.I. Andersen, J.B. Bilde-Sorensen, T. Lorentzen O.B. Pedersen and N.J. Sorensen. Riso, Denmark (1994) p. 487.
    • (1994) Proc. 15th Risø Int. Symp. , pp. 487
    • Raabe, D.1    Hangen, U.2
  • 17
    • 0346873152 scopus 로고
    • supp.
    • supp. J. Phys. (Paris) III 3 (1993) 1727.
    • (1993) J. Phys. (Paris) III , vol.3 , pp. 1727
  • 32
    • 0040267685 scopus 로고
    • ed. S. Nagashima ISIJ
    • H. Honneff and H. Mecking, in: Proc. ICOTOM 6, ed. S. Nagashima ISIJ (1981) p. 347.
    • (1981) Proc. ICOTOM , vol.6 , pp. 347
    • Honneff, H.1    Mecking, H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.