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Volumn 435-436, Issue , 2006, Pages 237-244
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Microstructure evolution and properties of Cu-Ag microcomposites with different Ag content
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Author keywords
Cu Ag alloy; Electrical conductivity; Microstructure; Tensile strength
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Indexed keywords
COPPER ALLOYS;
ELECTRIC CONDUCTIVITY;
EUTECTICS;
METAL DRAWING;
METALLOGRAPHIC MICROSTRUCTURE;
SILVER ALLOYS;
STRAIN HARDENING;
TENSILE STRENGTH;
VOLUME FRACTION;
COLD DRAWING;
EUTECTIC MORPHOLOGY;
EUTECTIC VOLUME FRACTION;
METALLIC MATRIX COMPOSITES;
COPPER ALLOYS;
ELECTRIC CONDUCTIVITY;
EUTECTICS;
METAL DRAWING;
METALLIC MATRIX COMPOSITES;
METALLOGRAPHIC MICROSTRUCTURE;
SILVER ALLOYS;
STRAIN HARDENING;
TENSILE STRENGTH;
VOLUME FRACTION;
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EID: 33748917098
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2006.07.125 Document Type: Article |
Times cited : (108)
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References (22)
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