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Volumn 435-436, Issue , 2006, Pages 237-244

Microstructure evolution and properties of Cu-Ag microcomposites with different Ag content

Author keywords

Cu Ag alloy; Electrical conductivity; Microstructure; Tensile strength

Indexed keywords

COPPER ALLOYS; ELECTRIC CONDUCTIVITY; EUTECTICS; METAL DRAWING; METALLOGRAPHIC MICROSTRUCTURE; SILVER ALLOYS; STRAIN HARDENING; TENSILE STRENGTH; VOLUME FRACTION;

EID: 33748917098     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.07.125     Document Type: Article
Times cited : (108)

References (22)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.