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Volumn 7122, Issue , 2008, Pages
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Double-patterning decomposition, design compliance, and verification algorithms at 32nm hp
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Author keywords
Design compliance; Design verification; Double patterning; OPC; Pitch splitting
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Indexed keywords
CHIP DESIGNS;
CRITICAL LAYERS;
DESIGN VERIFICATION;
DOUBLE PATTERNING;
HIGH CAPACITIES;
IC DESIGNS;
MANUFACTURING KNOWLEDGE;
MASK SYNTHESIS;
MENTOR GRAPHICS;
MULTIPLE EXPOSURES;
OPC;
PARAMETERIZATION SCHEMES;
PATTERNING TECHNOLOGIES;
PHYSICAL EFFECTS;
PHYSICAL SYNTHESIS;
PITCH SPLITTING;
PROCESS VARIANCES;
RAYLEIGH LIMITS;
RESIST LAYERS;
SUB RESOLUTIONS;
TECHNOLOGY STRATEGIES;
VERIFICATION ALGORITHMS;
DYNAMIC POSITIONING;
INDUSTRIAL APPLICATIONS;
INTEGRATED CIRCUITS;
OPTOELECTRONIC DEVICES;
PERCOLATION (SOLID STATE);
TECHNOLOGY;
DESIGN;
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EID: 62649143646
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.801381 Document Type: Conference Paper |
Times cited : (12)
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References (6)
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