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Volumn 109, Issue 5, 2009, Pages 637-643
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Thermal stability of a Co/Cu giant magnetoresistance (GMR) multilayer system
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Author keywords
GMR; Thin films; wide angle tomographic atom probe (WATAP)
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Indexed keywords
[CO/CU];
CU LAYERS;
FERROMAGNETIC COUPLINGS;
GMR;
GMR EFFECTS;
HIGH-ANGLE GRAIN BOUNDARIES;
ION-BEAM SPUTTERING;
LAYER INTERFACES;
LAYERED STRUCTURES;
MAGNETORESISTIVE;
MORPHOLOGICAL CHANGES;
MULTI-LAYER SYSTEMS;
TEMPERATURE RANGES;
THERMAL REACTIONS;
THERMAL STABILITIES;
THIN FILM MULTILAYERS;
TUNGSTEN TIPS;
WIDE-ANGLE TOMOGRAPHIC ATOM PROBE (WATAP);
ATOMS;
DETERIORATION;
ELECTRIC RESISTANCE;
FILM PREPARATION;
GALVANOMAGNETIC EFFECTS;
GRAIN BOUNDARIES;
GRAIN SIZE AND SHAPE;
HEAT TREATMENT;
MAGNETIC RECORDING;
MAGNETOELECTRONICS;
MULTILAYERS;
PROBES;
SPUTTERING;
SYSTEM STABILITY;
THERMAL EFFECTS;
THERMODYNAMIC STABILITY;
TUNGSTEN;
GIANT MAGNETORESISTANCE;
ALLOY;
COBALT;
COPPER;
TUNGSTEN;
ARTICLE;
HEAT TREATMENT;
MAGNETISM;
TEMPERATURE DEPENDENCE;
THERMOSTABILITY;
TOMOGRAPHY;
WIDE ANGLE TOMOGRAPHIC ATOM PROBE;
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EID: 62549126862
PISSN: 03043991
EISSN: None
Source Type: Journal
DOI: 10.1016/j.ultramic.2008.11.026 Document Type: Article |
Times cited : (13)
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References (27)
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