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Volumn 6349 II, Issue , 2006, Pages
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Application challenges with double patterning technology (DPT) beyond 45nm
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Author keywords
And model based OPC; Coloring line method (CLN); Coloring space method (CSP); DDL; DET; Double exposure technology; Double patterning technology; DPT; Feature stitching; Lithography; Mask error factor; MEF; Such as Double Dipole
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Indexed keywords
COMPUTER SIMULATION;
MATHEMATICAL MODELS;
OPTICAL RESOLVING POWER;
PHOTOLITHOGRAPHY;
AND MODEL-BASED OPC;
COLORING LINE METHOD (CLN);
COLORING SPACE METHOD (CSP);
DDL;
DOUBLE EXPOSURE TECHNOLOGY (DET);
DOUBLE PATTERNING TECHNOLOGY (DPT);
FEATURE STITCHING;
MASK ERROR FACTOR (MEF);
SUCH AS DOUBLE DIPOLE;
IMAGING TECHNIQUES;
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EID: 33846591914
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.692921 Document Type: Conference Paper |
Times cited : (53)
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References (5)
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