Preparation of carbon fibers/carbon/alumina tubular composite membranes and their applications in treating Cu-CMP wastewater by a novel electrochemical process: Part 2

Journal of Membrane Science

Volumn 331, Issue 1-2, 2009, Pages 100-108

  Yang, Gordon C C ^a   Tsai, Chi Ming ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Carbon fiber; Cu CMP wastewater; Electrocoagulation; Electrofiltration; Tubular composite membrane

Indexed keywords

CATALYST PRECURSORS; COPPER LAYERS; CROSS FLOWS; CROSS-FLOW VELOCITIES; CU-CMP WASTEWATER; ELECTRIC FIELD STRENGTHS; ELECTROCHEMICAL PROCESS; ELECTROCOAGULATION; ELECTROFILTRATION; ENVIRONMENTAL SCANNING ELECTRON MICROSCOPIES; EXPERIMENTAL DESIGNS; EXPERIMENTAL FACTORS; FILM WRAPPINGS; FILTRATION AREAS; FRACTIONAL FACTORIALS; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPIES; OPTIMAL OPERATING CONDITIONS; PERFORMANCE TESTS; PERMPOROMETRY; PORE SIZE DISTRIBUTIONS; REMOVAL EFFICIENCIES; TAGUCHI EXPERIMENTAL DESIGNS; TOTAL ORGANIC CARBONS; TOTAL SOLIDS; TRANS-MEMBRANE PRESSURES; TUBULAR COMPOSITE MEMBRANE; WAFER FAB;

BIOCHEMICAL OXYGEN DEMAND; CARBON FIBERS; CARBONIZATION; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; CHEMICAL VAPOR DEPOSITION; CHEMICALS REMOVAL (WATER TREATMENT); CHLORINE COMPOUNDS; COAGULATION; DESIGN OF EXPERIMENTS; ELECTRIC FIELDS; FIRE HAZARDS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NANOTECHNOLOGY; ORGANIC CARBON; POLYVINYLIDENE CHLORIDES; PORE SIZE; RANGE FINDING; REMOVAL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STATISTICS; TAGUCHI METHODS; TURBIDITY; WASTEWATER; WASTEWATER TREATMENT; WATER RECYCLING;

COMPOSITE MEMBRANES;

ALUMINUM; CARBON FIBER; COPPER; POLYMER; POLYVINYLIDENE CHLORIDE; SILICON; UNCLASSIFIED DRUG;

ARTICLE; ARTIFICIAL MEMBRANE; COMPOSITE MATERIAL; ELECTRIC FIELD; ELECTROCHEMISTRY; ELECTROCOAGULATION; MEMBRANE TECHNOLOGY; PRIORITY JOURNAL; RAMAN SPECTROMETRY; SCANNING ELECTRON MICROSCOPY; TOTAL ORGANIC CARBON; TRANSMISSION ELECTRON MICROSCOPY; WASTE WATER MANAGEMENT;

EID: 61549083064     PISSN: 03767388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.memsci.2009.01.021     Document Type: Article

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