Treatment of chemical mechanical polishing wastewater by electrocoagulation: System performances and sludge settling characteristics

Chemosphere

Volumn 54, Issue 3, 2004, Pages 235-242

  Lai, Chen L ^a   Lin, Sheng H ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

CMP wastewater; Copper and COD removal; Electrocoagulation; Sludge settling velocity; Solids flux

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CHEMICAL OXYGEN DEMAND; COAGULATION; SEWAGE SLUDGE; TURBIDITY;

ELECTROCOAGULATION;

WASTEWATER TREATMENT;

ALUMINUM; COPPER ION; IRON;

CHEMICAL OXYGEN DEMAND; COAGULATION; COPPER; ELECTROCHEMICAL PROCESS; PARTICULATE MATTER; PERFORMANCE ASSESSMENT; WASTEWATER TREATMENT;

ARTICLE; CHEMICAL OXYGEN DEMAND; CONCENTRATION (PARAMETERS); ELECTROCOAGULATION; ELECTRODE; QUALITY CONTROL; SEMICONDUCTOR; SLUDGE SETTLING; SUSPENDED PARTICULATE MATTER; TURBIDITY; VELOCITY; WASTE WATER MANAGEMENT;

GADUS MORHUA;

EID: 0348046371     PISSN: 00456535     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.chemosphere.2003.08.014     Document Type: Article

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