The many options for managing CMP wastewater

Solid State Technology

Volumn 47, Issue 7, 2004, Pages

  Jenkins, Brian V ^a   Myers, Craig W ^a   Lesiak, Stan ^b   Viscomi, Richard ^b  

^a NALCO COMPANY   (United States)

^b CABOT MICROELECTRONICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSCRATCHING; WAFER PROCESSING; WASTE STREAMS; WASTE WATER COMPOSITION;

ABRASIVES; COOLING; COPPER; DIELECTRIC DEVICES; DRAINAGE; FILTRATION; ION EXCHANGE; PRECIPITATION (CHEMICAL); REVERSE OSMOSIS; SCRUBBERS; SLUDGE DISPOSAL; SLURRIES; WASTE TREATMENT; WASTEWATER TREATMENT; WATER RECYCLING;

CHEMICAL MECHANICAL POLISHING;

EID: 3242683574     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)