Numerical simulation of dynamic wetting behavior in the wetting balance method

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1816-1820

  Han, Jeong Whan ^a   Lee, Hwang Gu ^a   Park, Jae Yong ^a  

^a Inha University   (South Korea)

Author keywords

Computer simulation; Solderability; Wettability; Wetting balance method; Wetting force; Wetting time

Indexed keywords

COMPUTER SIMULATION; CORROSION; INTEGRATED CIRCUIT MANUFACTURE; LAPLACE TRANSFORMS; VISCOSITY; WETTING;

SOLDERABILITY; WETTING FORCE;

SOLDERING ALLOYS;

EID: 0036698708     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1816     Document Type: Article

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