Influence of hydrodynamics and pulse plating parameters on the electrocodeposition of nickel-alumina nanocomposite films

Electrochimica Acta

Volumn 54, Issue 9, 2009, Pages 2491-2498

  Thiemig, Denny ^a   Bund, Andreas ^a   Talbot, Jan B ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Alumina; Electrocodeposition; Impinging jet electrode; Nickel nanocomposites; Pulse plating

Indexed keywords

ALUMINA; ALUMINUM; CRYSTALLITE SIZE; ELECTROPLATING; FLUID DYNAMICS; HARDNESS; JETS; METALLIC MATRIX COMPOSITES; NANOCOMPOSITES; NICKEL; NICKEL ALLOYS; NICKEL DEPOSITS; PUMPING PLANTS; TEXTURES;

CURRENT MODULATIONS; DEPOSITION CONDITIONS; DIRECT-CURRENTS; ELECTROCODEPOSITION; ELECTRODE CONFIGURATIONS; ENHANCED HARDNESS; IMPINGING JET ELECTRODE; NANO PARTICLES; NANO-COMPOSITE FILMS; NICKEL ALUMINAS; NICKEL COATINGS; NICKEL MATRIXES; PARALLEL-PLATE ELECTRODES; PARTICLE CONTENTS; PARTICLE LOADINGS; PULSE PLATING; PULSE REVERSE PLATINGS;

COMPOSITE FILMS;

EID: 60949094643     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.04.004     Document Type: Article

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