Effect of pulse plating parameters on the composition of alumina/nickel composite

Journal of the Electrochemical Society

Volumn 152, Issue 8, 2005, Pages

  Xiong Skiba, Pei ^a   Engelhaupt, Darell ^b   Hulguin, Ryan ^a   Ramsey, Brian ^c  

^a AUSTIN PEAY STATE UNIVERSITY   (United States)

^b UNIVERSITY OF ALABAMA IN HUNTSVILLE   (United States)

^c NATIONAL SPACE SCIENCE AND TECHNOLOGY CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; COMPOSITION; ELECTROPLATING; NICKEL COMPOUNDS; PLATING; THICKNESS MEASUREMENT;

DIRECT CURRENT PLATING; NICKEL OXIDE; PULSE PLATING; SULFAMATE BATH;

COMPOSITE MATERIALS;

EID: 25644438398     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1948947     Document Type: Article

References (13)

1. R. Narayan and B. H. Narayana, Rev. Coat. Corros., 4, 113 (1981).
2. A. Hovestad and L. J. J. Janssen, J. Appl. Electrochem., 25, 519 (1995).
3. M. Musiani, Electrochim. Acta, 45, 3397 (2000).
4. D. Landolt, J. Electrochem. Soc., 149, S9 (2002).
5. V. Greco, Electrocomposites: The Strengthening of Metals with Particles or Fibers by Electrodeposition Techniques, American Electroplaters and Surface Finishers Society, Orlando, FL (1988).
6. J. L. Stojak and J. B. Talbot, J. Electrochem. Soc., 146, 4504 (1999).
7. Y.-S. Chang and J.-Y. Lee, Mater. Chem. Phys., 20, 309 (1988).
8. E. J. Podlaha and D. Landolt, J. Electrochem. Soc., 144, L200 (1997).
9. N. Guglielmi, J. Electrochem. Soc., 119, 1009 (1972).
10. J. P. Celis, J. R. Roos, C. Buelens, and J. Fransaer, Trans. Inst. Met. Finish., 69, 133, (1991).
11. J. Fransaer, J. P. Celis, and J. R. Roos, Met. Finish., 91, 97 (1993).
12. I. Shao, P. M. Vereecken, R. C. Cammarata, and P. C. Searson, J. Electrochem. Soc., 149, C610 (2002).
13. P. R. Webb, and N. L. Robertson, J. Electrochem. Soc., 141, 669 (1994).