Ni-P-SiC composite produced by pulse and direct current plating

Materials Chemistry and Physics

Volumn 100, Issue 1, 2006, Pages 54-59

  Hou, Kung Hsu ^a   Hwu, Wen Hwa ^a   Ke, Shih Tsung ^a   Ger, Ming Der ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

Author keywords

Composite electroplating; Direct plating; Ni P alloy; Pulse plating

Indexed keywords

COMPOSITE MATERIALS; DC POWER TRANSMISSION; ELECTROPLATING; MICROHARDNESS; SILICON CARBIDE;

COMPOSITE ELECTROPLATING; DIRECT PLATING; NI-P ALLOY; PULSE CURRENT (PC); PULSE PLATING;

NICKEL ALLOYS;

EID: 33748899634     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2005.12.016     Document Type: Article

References (24)

1. Liu Y.C., Wang J.W., Peng Y.M., Chen H.J., Shen J.H., and Huang C.A. MRL. Bull. Res. Dev. 4 (1990) 31
2. Ghouse M. Met. Finish. 4 (1984) 33
3. Hovestad A., and Janssen L.J.J. J. Appl. Electrochem. 25 (1995) 519
4. Ferkel H., Mueller B., and Riehemann W. Mater. Sci. Eng. A 234-236 (1997) 474
5. Benea L., Luigi Bonora P., Borello A., Martelli S., Wenger F., Ponthiaux P., and Galland J. J. Electrochem. Soc. 148 (2001) C461
6. Cheng D.H., Xu W.Y., Hua L.Q., Zhang Z.Y., and Wan X.J. Plat. Surf. Finish. 85 2 (1998) 61
7. Huichen Z., and Mengxiong Z. Mater. Mech. Eng. 29 2 (1996) 20
8. Deying W., Yourong Xu., Haomin Z., and Biao W. Funct. Mater. 29 5 (1998) 502
9. Viderine A.B., and Podlaha E.J. J. Appl. Electrochem. 31 (2001) 461
10. Zaklina G., Dusan B., and Mirjana M. Mater. Character. 47 (2001) 129
11. Garcia I., Fransaer J., and Celis J.-P. Surf. Coat. Technol. 148 (2001) 171-178
12. Puippe J.C., and Leaman F. Theory and Practice of Pulse Plating (1986), American Electroplaters and Surface Finishers Society
13. Hu F., and Chan K.C. Appl. Surf. Sci. 233 (2004) 163
14. Barhrololoom M.E., and Sani R. Surf. Coat. Technol. 192 (2005) 154
15. Steinbach J., and Ferkel H. Script. Mater. 44 (2001) 1813
16. Qu N.S., Chan K.C., and Zhu D. Script. Mater. 50 (2004) 1131
17. Zimmerman A.F., Clark D.G., Aust K.T., and Erb U. Mater. Lett. 52 (2002) 85
18. Chen Y.C., Ger M.D., Hwu W.H., Kuo S.L., and Hou K.H. J. Chin. Colloid Interf. Soc. 24 (2002) 89
19. Ger M.D. Mater. Chem. Phys. 87 (2004) 67
20. Fransear J., Celis J.P., and Roos J.R. J. Electrochem. Soc. 139 (1992) 413
21. Hou K.H., Ger M.D., Wang L.M., and Ke S.T. Wear 253 (2002) 994
22. H. Nishimoto, Y. Sugizaki, K. Veda, JP 04026792 A2 (1992) 29.
23. Weil R., Lee J.H., Kim I., and Parker K. Plat. Surf. Finish. 76 2 (1989) 62
24. Chou M.C., Ger M.D., Ke S.T., Huang Y.R., and Wu S.T. Mater. Chem. Phys. 92 (2005) 146