Multilayer organic multichip module implementing hybrid microelectromechanical systems

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 4, 2008, Pages 952-958

  Chen, Morgan Jikang ^a,b,c   Pham, Anh Vu ^a,b   Evers, Nicole ^d   Kapusta, Chris ^d   Iannotti, Joseph ^d   Kornrumpf, William ^d,e   MacIel, John ^a,f  

^a IEEE

^b University of California   (United States)

^c Endwave Corporation   (United States)

^d GE GLOBAL RESEARCH   (United States)

^e MicroKorn LLC   (United States)

^f Radant MEMS Incorporated   (United States)

Author keywords

Cavities; Chip on flex; Liquid crystal polymer (LCP); Microelectromechanical systems (MEMS); Microwave; Packaging; Phase shifter

Indexed keywords

MEMS; MICROWAVES; PHASE SHIFTERS; POLYIMIDES; THIN FILMS;

LIQUID-CRYSTAL POLYMER (LCP); PACKAGING STRUCTURES;

ELECTRONICS PACKAGING;

EID: 41949093812     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2008.919642     Document Type: Article

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