Microfluidic pumps employing surface acoustic waves generated in ZnO thin films

Journal of Applied Physics

Volumn 105, Issue 2, 2009, Pages

  Du, X Y ^a   Fu, Y Q ^a,b   Luo, J K ^a,c   Flewitt, A J ^a   Milne, W I ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

^c UNIVERSITY OF BOLTON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC WAVES; ACOUSTICS; ACOUSTOELECTRIC EFFECTS; CONTACT ANGLE; DROP FORMATION; DROPS; ELASTIC WAVES; ELECTRODEPOSITION; HYDROPHILICITY; HYDROPHOBICITY; LABORATORIES; MAGNETRON SPUTTERING; METALLIC FILMS; OPTICAL FILMS; ORGANIC POLYMERS; PIEZOELECTRICITY; PUMPS; SEMICONDUCTING SILICON COMPOUNDS; SILANES; SURFACE CHEMISTRY; SURFACES; THIN FILMS; ZINC OXIDE;

ACOUSTIC PRESSURES; BIOLOGICAL LABORATORIES; DIRECT CONTACTS; DROPLET MOTIONS; HYDROPHILIC SURFACES; HYDROPHOBIC SURFACES; INPUT AND OUTPUTS; INPUT VOLTAGES; LEADING EDGES; LIQUID DROPLETS; MICRO-FLUIDIC PUMPS; NANO-CRYSTALLINE; OCTADECYLTRICHLOROSILANE; PIEZOELECTRIC THIN FILMS; RF SIGNALS; RF- MAGNETRON SPUTTERING; SAW DEVICES; SELF-ASSEMBLED MONOLAYERS; SI SUBSTRATES; SURFACE ACOUSTIC WAVES; THRESHOLD LEVELS; WATER CONTACT ANGLES; WATER DROPLETS; WAVE MODES; ZNO; ZNO SURFACES; ZNO THIN FILMS;

SEMICONDUCTING ZINC COMPOUNDS;

EID: 59349104797     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3068326     Document Type: Article

References (52)

1. D. S. Ballantine, R. M. White, S. J. Martin, A. J. Ricco, E. T. Zellers, G. C. Frye, and H. Wohltjen, Acoustic Wave Sensor: Theory, Design, & Physico-Chemical Applications (Academic, New York, 1996).
2. M. Hoummady, A. Campitelli, and W. Wlodarski, Smart Mater. Struct. 0964-1726 10.1088/0964-1726/6/6/001 6, 647 (1997).
3. D. W. Galipeau, P. R. Sory, K. A. Vetelino, and R. D. Mileham, Smart Mater. Struct. 0964-1726 10.1088/0964-1726/6/6/002 6, 658 (1997).
4. M. J. Vellekoop, Ultrasonics 0041-624X 10.1016/S0041-624X(97)00146-7 36, 7 (1998).
5. S. Shiokawa and J. Kondoh, Jpn. J. Appl. Phys., Part 1 43, 2799 (2004).
6. E. Gizeli, Smart Mater. Struct. 0964-1726 10.1088/0964-1726/6/6/006 6, 700 (1997).
7. N. -T. Nguyen, X. Huang, and T. K. Chuan, J. Fluids Eng. 0098-2202 10.1115/1.1459075 124, 384 (2002).
8. C. S. Zhang, D. Xing, and Y. Y. Li, Biotechnol. Adv. 25, 483 (2007). 0734-9750
9. Z. Guttenberg, H. Muller, H. Habermuller, A. Geisbauer, J. Pipper, J. Felbel, M. Kielpinski, J. Scriba, and A. Wixforth, Lab Chip 1473-0197 10.1039/b412712a 5, 308 (2005).
10. A. Renaudin, P. Tabourier, J. -C. Camart, and C. Druon, J. Appl. Phys. 0021-8979 10.1063/1.2388725 100, 116101 (2006).
11. A. Renaudin, P. Tabourier, V. Zhang, J. -C. Camart, and C. Druon, Sens. Actuators B 0925-4005 10.1016/j.snb.2005.03.100 113, 389 (2006).
12. X. Y. Du, Y. Q. Fu, S. C. Tan, J. K. Luo, A. J. Flewitt, S. Maeng, S. H. Kim, Y. J. Choi, D. S. Lee, N. M. Park, J. Park, and W. I. Milne, J. Phys.: Conf. Ser. 1742-6588 10.1088/1742-6596/76/1/012035 76, 012035 (2007).
13. J. W. Gardner, V. K. Varadan, and O. O. Awadelkarim, Microsensors, MEMS and Smart Device (Wiley, New York, 2001).
14. H. L. Bertoni and T. Tamir, Appl. Phys. 2, 157 (1973).
15. S. Shiokawa, Y. Matsui, and T. Ueda, J. Appl. Phys. 29, 137 (1990).
16. M. I. Newton, M. K. Banerjee, T. K. H. Starke, S. M. Bowan, and G. McHale, Sens. Actuators, A 76, 89 (1999). 0924-4247
17. A. Wixforth, Superlattices Microstruct. 0749-6036 10.1016/j.spmi.2004.02. 015 33, 389 (2003).
18. S. Shiokawa, Y. Matsui, and T. Morizum, Jpn. J. Appl. Phys., Part 1 28, 126 (1989). 0021-4922
19. T. Koga and M. Morita, Langmuir 0743-7463 10.1021/la048544s 21, 905 (2005).
20. S. Shiokawa, Y. Matsi, and T. Morizumi, Jpn. J. Appl. Phys., Part 1 28, 126 (1989). 0021-4922
21. J. C. Rife, M. I. Bell, J. S. Horwitz, M. N. Kabler, R. C. Y. Auyeung, and W. J. Kim, Sens. Actuators, A 0924-4247 10.1016/S0924-4247(00)00433-7 86, 135 (2000).
22. A. Wixforth, J. Assoc. Lab. Autom. 11, 399 (2006).
23. S. Alzuaga, S. Ballandras, F. Bastien, W. Daniau, B. Gauthier-Manuel, J. F. Manceau, B. Cretin, P. Vairac, V. Laude, A. Khelif, and R. Duhamel, Proc.-IEEE Ultrason. Symp. 2, 1790 (2003).
24. M. Rotter, A. V. Kalameitsev, A. O. Govorov, W. Ruile, and A. Wixforth, Phys. Rev. Lett. 0031-9007 10.1103/PhysRevLett.82.2171 82, 2171 (1999).
25. W. K. Tseng, J. L. Lin, W. C. Sung, S. H. Chen, and G. B. Lee, J. Micromech. Microeng. 0960-1317 10.1088/0960-1317/16/3/009 16, 539 (2006).
26. A. Toegl, R. Kirchner, C. Gauer, and A. Wixforth, J. Biomol. Tech. 14, 197 (2003). 1524-0215
27. K. Sritharan, C. J. Strobl, M. F. Schneider, and A. Wixforth, Appl. Phys. Lett. 0003-6951 10.1063/1.2171482 88, 054102 (2006).
28. W. K. Tseng and J. L. Lin, J. Micromech. Microeng. 0960-1317 10.1088/0960-1317/16/3/009 16, 539 (2006).
29. A. Sano, Y. Matsui, and S. Shiokawa, Jpn. J. Appl. Phys., Part 1 0021-4922 10.1143/JJAP.37.2979 37, 2979 (1998).
30. C. J. Strobl, Z. V. Guttenberg, and A. Wixforth, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 0885-3010 10.1109/TUFFC.2004.1367483 51, 1432 (2004).
31. K. Chono, N. Shimizu, Y. Matsu, J. Kondoh, and S. Shiokawa, Jpn. J. Appl. Phys., Part 1 0021-4922 10.1143/JJAP.43.2987 43, 2987 (2004).
32. J. W. Kwon, H. Yu, Q. Zou, and E. S. Kim, J. Micromech. Microeng. 0960-1317 10.1088/0960-1317/16/12/024 16, 2697 (2006).
33. S. J. Pearton, D. P. Norton, K. Ip, Y. W. Heo, and T. Steiner, Prog. Mater. Sci. 0079-6425 10.1016/j.pmatsci.2004.04.001 50, 293 (2005).
34. W. Water and S. Y. Chu, Mater. Lett. 0167-577X 10.1016/S0167-577X(01) 00621-8 55, 67 (2002).
35. H. W. Kim and N. H. Kim, Phys. Status Solidi A 201, 235 (2004). 0031-8957
36. X. Y. Du, Y. Q. Fu, S. C. Tan, J. K. Luo, A. J. Flewitt, W. I. Milne, D. S. Lee, S. Maeng, S. H. Kim, N. M. Park, Y. J. Choi, J. Park, and Y. J. Choi, Appl. Phys. Lett. 0003-6951 10.1063/1.2970960 93, 094105 (2008).
37. V. Laude, L. Robert, W. Daniau, A. Khelif, and S. Ballandras, Appl. Phys. Lett. 0003-6951 10.1063/1.2338523 89, 083515 (2006).
38. G. Kenanakis, E. Stratakis, K. Vlachou, D. Vernardou, E. Koudoumas, and N. Natsarakis, Appl. Surf. Sci. 0169-4332 10.1016/j.apsusc.2008.03.055 254, 5695 (2008).
39. D. Beyssen, L. Le Brizoual, O. Emazria, and P. Alnot, Proc.-IEEE Ultrason. Symp. 2, 1028 (2005).
40. C. G. L. Furmidge, J. Colloid Sci. 0095-8522 10.1016/0095-8522(62)90011-9 17, 309 (1962).
41. G. D. Yarnold, Proc. Phys. Soc. (London) 50, 540 (1938). 0370-1328
42. X. Y. Du, M. Swanwick, Y. Q. Fu, J. K. Luo, A. J. Flewitt, D. S. Lee, S. Maeng, and W. I. Milne, J. Micromech. Microeng. (unpublished).
43. X. Q. Bao, W. Burkhard, V. Varadan, and V. K. Varadan, Proc.-IEEE Ultrason. Symp. 14-16, 583 (1987).
44. K. Tsubouchi and N. Mikoshiba, IEEE Trans. Sonics Ultrason. 32, 634 (1985). 0018-9537
45. A. Kawai and K. Suzuki, Jpn. J. Appl. Phys., Part 1 45, 5429 (2006). 0021-4922
46. M. G. Pollack, R. B. Fair, and A. D. Shenderov, Appl. Phys. Lett. 0003-6951 10.1063/1.1308534 77, 1725 (2000).
47. M. G. Pollack, A. D. Shenderov, and R. B. Fair, Lab Chip 1473-0197 10.1039/b110474h 2, 96 (2002).
48. B. A. Buchine, W. L. Hughes, F. L. Degertekin, and Z. L. Wang, Nano Lett. 1530-6984 10.1021/nl060351x 6, 1155 (2006).
49. Y. Shu and D. F. Xue, Fourth International Conference on technol. advance of thin film & surf. coatings; Singapore, July 2008 (unpublished), pp. 92.
50. E. Gizeli, Anal. Chem. 0003-2700 10.1021/ac000694u 72, 5967 (2000).
51. J. Kondoh, N. Shimizu, Y. Matsui, and S. Shiokawa, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 52, 1881 (2005).
52. R. G. Kryshtal, A. P. Kundin, A. V. Medved, and V. V. Shemet, Tech. Phys. Lett. 1063-7850 10.1134/1.1448641 28, 50 (2002).