Thermal-strain-induced enhancement of electromagnetic properties of SiC- MgB2 composites

Applied Physics Letters

Volumn 94, Issue 4, 2009, Pages

  Zeng, R ^a   Dou, S X ^a   Lu, L ^a   Li, W X ^a   Kim, J H ^a   Munroe, P ^b   Zheng, R K ^c   Ringer, S P ^c  

^a UNIVERSITY OF WOLLONGONG   (Australia)

^b UNIVERSITY OF NEW SOUTH WALES   (Australia)

^c UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; SILICON CARBIDE; STRAIN; THERMAL SPRAYING;

CHEMICAL SUBSTITUTIONS; CRITICAL CURRENT DENSITIES; CRITICAL TEMPERATURES; ELECTRO-MAGNETIC PROPERTIES; MGB2; PREMIXING; STRAIN-INDUCED ENHANCEMENTS; THERMAL EXPANSION CO-EFFICIENT; THERMAL STRAINS; TRANSMISSION ELECTRONS; UPPER CRITICAL FIELDS; X- RAY DIFFRACTIONS;

THERMAL EXPANSION;

EID: 59349085324     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3078396     Document Type: Article

References (15)

1. K. J. Choi, M. Biegalski, Y. L. Li, A. Sharan, J. Schubert, R. Uecker, P. Reiche, Y. B. Chen, X. Q. Pan, V. Gopalan, L. Q. Chen, D. G. Schlom, and C. B. Eom, Science SCIEAS 0036-8075 10.1126/science.1103218 306, 1005 (2004).
2. I. Bozovic, G. Logvenov, I. Belca, B. Narimbetov, and I. Sveklo, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.89.107001 89, 107001 (2002).
3. S. K. Streiffer, J. A. Eastman, D. D. Fong, C. Thompson, A. Munkholm, M. V. R. Murty, O. Auciello, G. R. Bai, and G. B. Stephenson, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.89.067601 89, 067601 (2002).
4. S. X. Dou, O. Shcherbakova, W. K. Yoeh, J. H. Kim, S. Soltanian, X. L. Wang, C. Senatore, R. Flukiger, M. Dhalle, O. Husnjak, and E. Babic, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.98.097002 98, 097002 (2007).
5. A. Matsumoto, H. Kumakura, H. Kitaguchi, B. J. Senkowicz, M. C. Jewell, E. E. Hellstrom, Y. Zhu, P. M. Voyles, and D. C. Larbalestier, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2357027 89, 132508 (2006).
6. M. D. Sumption, M. Bhatia, M. Rindfleisch, M. Tomsic, S. Soltanian, S. X. Dou, and E. W. Collings, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.1872210 86, 092507 (2005).
7. Y. Zhu, A. Matsumoto, B. J. Senkowicz, H. Kumakura, H. Kitaguchi, M. C. Jewell, E. E. Hellstrom, D. C. Larbalestier, and P. M. Voyles, J. Appl. Phys. JAPIAU 0021-8979 10.1063/1.2750409 102, 013913 (2007).
8. K. Togano, T. Nakane, H. Fujii, H. Takeya, and H. Kumakura, Supercond. Sci. Technol. SUSTEF 0953-2048 10.1088/0953-2048/19/6/L01 19, L17 (2006).
9. X. H. Zeng, A. V. Pogrebnyakov, M. H. Zhu, J. E. Jones, X. X. Xi, S. Y. Xu, E. Wertz, Q. Li, J. M. Redwing, J. Lettieri, V. Vaithyanathan, D. G. Schlom, Z. K. Liu, O. Trithaveesak, and J. Schubert, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.1563840 82, 2097 (2003).
10. J. J. Neumeier, T. Tomita, M. Debessai, J. S. Schilling, P. W. Barnes, D. G. Hinks, J. D. Jorgensen, Phys. Rev. B PRBMDO 0163-1829 10.1103/PhysRevB.72. 220505 72, 220505 (2005).
11. J. D. Jorgensen, D. G. Hinks, and S. Short, Phys. Rev. B PRBMDO 0163-1829 10.1103/PhysRevB.63.224522 63, 224522 (2001).
12. M. Dhalle, H. van Weeren, S. Wessel, A. den Ouden, H. H. J. ten Kate, I. Husek, P. Kovac, S. Schlachter, and W. Goldacker, Supercond. Sci. Technol. 18, S253 (2005). 0953-2048
13. K. P. Bohnen, R. Heid, and B. Renker, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.86.5771 86, 5771 (2001).
14. V. Paillard, P. Puech, R. Sirvin, S. Hamma, and P. R. I. Cabarrocas, J. Appl. Phys. JAPIAU 0021-8979 10.1063/1.1396828 90, 3276 (2001).
15. W. X. Li, Y. Li, R. H. Chen, R. Zeng, S. X. Dou, M. Y. Zhu, and H. M. Jin, Phys. Rev. B PRBMDO 0163-1829 10.1103/PhysRevB.77.094517 77, 094517 (2008).