New method for estimating impact strength of solder-ball-bonded interfaces in semiconductor packages

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 47, Issue 8 PART 1, 2008, Pages 6566-6568

  Morita, Toshiaki ^a   Kajiwara, Ryoichi ^a   Ueno, Isao ^a   Okabe, Satoru ^a  

^a HITACHI LTD   (Japan)

Author keywords

Drop test; Impact strength; Quantitive estimation; Shear test; Solder ball

Indexed keywords

BRAZING; ELECTRIC CONDUCTIVITY; SEMICONDUCTOR JUNCTIONS; SEMICONDUCTOR MATERIALS; SHEAR STRENGTH; SOLDERING; SPHERES; STRENGTH OF MATERIALS; WELDING;

ABSORBED ENERGIES; BONDED INTERFACES; DROP TEST; IMPACT FORCES; QUANTITIVE ESTIMATION; SEMICONDUCTOR PACKAGES; SHEAR TEST; SOLDER BALL; SOLDER BALLS; STRENGTH ESTIMATIONS;

IMPACT STRENGTH;

EID: 55149114430     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.6566     Document Type: Article

References (3)

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2. S. Oida, K, Oumori, S. Sakaguchi, and K. Matsushita: Proc. 8th Symp. Microjoining and Assembly Technology in Electronics, 2002, p. 253 [in Japanese].
3. Y. Nakahara, R. Ninomiya, J. Matsunaga, and T. Takemoto: Proc. 5th Symp. Microjoining and Assembly Technology in Electronics, 1999, p. 341 [in Japanese].