Electroless plating of copper on Si(100) surfaces modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Surface and Interface Analysis

Volumn 41, Issue 1, 2009, Pages 69-74

  Li, Liang ^a   Yan, Guoping ^a   Cheng, Zhiyu ^a   Wu, Jiangyu ^a   Yu, Xianghua ^a   Guo, Qingzhong ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

4 vinylpyridine; Copper; Electroless plating; Silicon; Surface chemical reaction

Indexed keywords

ADHESION; ATOM TRANSFER RADICAL POLYMERIZATION; ATOMIC PHYSICS; ATOMS; BOND STRENGTH (MATERIALS); CHEMICAL REACTIONS; CHEMISORPTION; COPPER; ELECTRODEPOSITION; ELECTROLESS PLATING; FREE RADICAL POLYMERIZATION; INORGANIC COATINGS; MONOMERS; NEWTONIAN FLOW; PALLADIUM; PALLADIUM COMPOUNDS; PLATING; POLYMERIZATION; POLYMERS; SILICON; SURFACE TOPOGRAPHY;

4-VINYLPYRIDINE; ADHESION PROMOTION; ADHESION STRENGTHS; CHEMISORPTION SITES; FORCE MICROSCOPY; PALLADIUM (II) COMPLEXES; PEEL ADHESION STRENGTH; SI(0 0 1) SURFACE; SI(1 0 0 ); SILICON (0 0 1) SURFACES; SURFACE CHEMICAL REACTION; SURFACE-INITIATED; TRANSFER RADICAL POLYMERIZATION;

SURFACE REACTIONS;

EID: 58449125000     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.2994     Document Type: Article

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