Assembly and reliability of a wafer-level CSP

Circuits Assembly

Volumn 15, Issue 5, 2004, Pages 28-33

  Meilunas, Michael ^a   Patel, Parvez ^b  

^a UNIVERSAL INSTRUMENTS CORPORATION   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIPS; SURFACE-MOUNT PITCHES; WAFER-LEVEL DEVICES; WEIBULL ANALYSIS;

FATIGUE OF MATERIALS; PRINTED CIRCUIT BOARDS; SILICON WAFERS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THERMAL EXPANSION; THIN FILMS; WEIBULL DISTRIBUTION;

CHIP SCALE PACKAGES;

EID: 2442526713     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)