Photoresist coating and patterning for through-silicon via technology

Journal of Micromechanics and Microengineering

Volumn 18, Issue 12, 2008, Pages

  Pham, N P ^a   Tezcan, D S ^a   Ruythooren, W ^a   De Moor, P ^a   Majeed, B ^a   Baert, K ^a   Swinnen, B ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; ELECTRON BEAM LITHOGRAPHY; PHOTORESISTORS; PHOTORESISTS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE TREATMENT; THREE DIMENSIONAL;

CONFORMAL COATINGS; ELECTRICAL CONNECTIONS; PATTERN DEFINITIONS; PHOTORESIST COATINGS; RESIST LAYERS; RESIST THICKNESSES; SPRAY COATINGS; VIA TECHNOLOGIES; WAFER INTERCONNECTS;

COATINGS;

EID: 58149356990     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/12/125008     Document Type: Article

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