Via interconnections for wafer level packaging: Impact of via shape on spray coating behavior

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 820-824

  Shariff, Dzafir ^a   Suthiwonsunthorn, Nathapong ^a   Bieck, Florian ^a  

^a SCHOTT Advanced Packaging Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CLADDING (COATING); COATINGS; DIGITAL IMAGE STORAGE; ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; ETCHING; GEOMETRICAL OPTICS; IMAGE SENSORS; LITHOGRAPHY; METALLIZING; NONMETALS; OPTICAL SENSORS; PACKAGING; PAPER COATING; PESTICIDES; PLASMA ETCHING; PLASMA STABILITY; SENSORS; SILICON; SILICON WAFERS; SPRAYING; TECHNOLOGY;

ADVANCED PACKAGING; BOND PADS; DIRECT CONTACTS; ELECTRICAL CONNECTIONS; FORMING PROCESSES; OPTICAL IMAGING; PACKAGING TECHNOLOGIES; PROCESS STEPS; PRODUCTION CONDITIONS; REDISTRIBUTION LAYER; SPRAY COATINGS; TRANSMISSION PATHS; WAFER-LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 50049086860     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342818     Document Type: Conference Paper

References (4)

1. J. Leib and M. Topper, New Wafer -Level Packaging Technology Using Silicon -Via -Contacts for Optical And Other Sensor Applications._54th ECTC conference, Las Vegas 2004 USA.
2. G. Viswanadam, F. Bieck and N. Suthiwongsunthorn, Novel Wafer Level Package Technology Studies for Image Sensor Devices. EPTC conference 2005, Singapore.
3. Ha-Duong Ngo, A. Hiess, V. Seidemann, D. Studzinski, M. Lange, J. Leib, D. Shariff, H. Ashraf, M. Steel, L. Atabo, J. Reast, Plasma Etching of Tapered Features in Silicon for MEMS and Wafer Level Packaging Applications, Proceedings of the International MEMS Conference, 2006, Singapore
4. Lieberman, A.M., "Principles of Plasma Discharges and Materials Processing", John Wiley & Sons, New York, 1994.