Spray coating - A solution for resist film deposition across severe topography

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 338-341

  Fischer, K ^a   Suss R ^a  

^a SUSS MicroTec Lithography GmbH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRODEPOSITION; ELECTROPLATING; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; PARAMETER ESTIMATION; PHOTORESISTS; SPIN COATING; SURFACE TENSION;

COATING CHAMBERS; FILM DEPOSITION; FILM THICKNESS; LAMINATED FILMS;

SPRAYED COATINGS;

EID: 4644313558     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Cullmann, E., "Continuous Thick Resist film Deposition Across Severe Topography", Semicon Europe 2004
2. Fukai, J., et al., "Wetting effects on the spreading of a liquid droplet colliding with a flat surface: Experiment and modeling", Phys. Fluids 7(2), February 1995
3. Suss MicroTec, at http://www.suss.com