Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi-physics simulations

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Bielen, Jeroen ^a   Gommans, Jan Joris ^a   Theunis, Frank ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; ELECTRIC WIRE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; PLASTIC DEFORMATION;

ALUMINUM WIRE; BOND WIRE; LDMOS; STRESS LEVELS;

FATIGUE OF MATERIALS;

EID: 33847100123     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644022     Document Type: Conference Paper

References (10)

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