SCOPUS 정보 검색 플랫폼

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2008, Pages 209-212

Sensitivity computation of interconnect capacitances with respect to geometric parameters

(4) Bi, Yu a Van Der Kolk, K a Ioan, D b Van Der Meijs, N P a

a DELFT UNIVERSITY OF TECHNOLOGY (Netherlands)

b UNIVERSITY POLITEHNICA OF BUCHAREST (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTRONICS PACKAGING; NUMERICAL ANALYSIS; SENSITIVITY ANALYSIS;

3D CAPACITANCES; ADJOINT TECHNIQUES; DIMENSIONAL VARIATIONS; GEOMETRIC PARAMETERS; INTER-CONNECTS; INTERCONNECT CAPACITANCES; SENSITIVITY COMPUTATIONS;

BOUNDARY ELEMENT METHOD;

EID: 58049114599 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/EPEP.2008.4675916 Document Type: Conference Paper

Times cited : (6)

References (7)

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4
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5
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- Y. Bi, N. van der Meijs, and D. loan, "Capacitance sensitivity calculation for interconnects by adjoint field technique," in 12th IEEE Workshop on Signal Propagation on Interconnects, 2008.

6
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7
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.