Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 26-33

  Aschenbrenner, R ^a   Ostmann, A ^a   Motulla, G ^a   Zakel, E ^a   Reichl, H ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVE JOINTS; ADHESIVES; BONDING; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; THERMAL EFFECTS;

ANISOTROPIC CONDUCTIVE ADHESIVES; CHIP ON FLEX (COF) TECHNOLOGY; CHIP ON GLASS (COG) TECHNOLOGY; ELECTROLESS NICKEL BUMPS;

FLIP CHIP DEVICES;

EID: 0030394418     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)