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1
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50249185641
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K. Mistry, C. Allen, C. Auth, B. Beattie, D. Bergstrom, M. Bost, M. Brazier, M. Buehler, A. Cappellani, R. Chau, C.-H. Choi, G. Ding, K. Fischer, T. Ghani, R. Grover, W. Han, D. Hanken, M. Hattendorf, J. He, J. Hicks, R. Huessner, D. Ingerly, P. Jain, R. James, L. Jong, S. Joshi, C. Kenyon, K. Kuhn, K. Lee, H. Liu, J. Maiz, B. McIntyre, P. Moon, J. Neirynck, S. Pae, C. Parker, D. Parsons, C. Prasad, L. Pipes, M. Prince, P. Ranade, T. Reynolds, J. Sandford, L. Shifren, J. Sebastian, J. Seiple, D. Simon, S. Sivakumar, P. Smith, C. Thomas, T. Troeger, P. Vandervoom, S. Williams, K. Zawadzki, A 45nm Logic Technology with High-K+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging, International Electron Devices Meeting (IEDM) Technical Digest, 2007, pp. 247-250
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K. Mistry, C. Allen, C. Auth, B. Beattie, D. Bergstrom, M. Bost, M. Brazier, M. Buehler, A. Cappellani, R. Chau, C.-H. Choi, G. Ding, K. Fischer, T. Ghani, R. Grover, W. Han, D. Hanken, M. Hattendorf, J. He, J. Hicks, R. Huessner, D. Ingerly, P. Jain, R. James, L. Jong, S. Joshi, C. Kenyon, K. Kuhn, K. Lee, H. Liu, J. Maiz, B. McIntyre, P. Moon, J. Neirynck, S. Pae, C. Parker, D. Parsons, C. Prasad, L. Pipes, M. Prince, P. Ranade, T. Reynolds, J. Sandford, L. Shifren, J. Sebastian, J. Seiple, D. Simon, S. Sivakumar, P. Smith, C. Thomas, T. Troeger, P. Vandervoom, S. Williams, K. Zawadzki, "A 45nm Logic Technology with High-K+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging," International Electron Devices Meeting (IEDM) Technical Digest, 2007, pp. 247-250.
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2
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35348909664
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The High-k Solution
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Oct
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M. Bohr, R. Chau, T. Ghani and K. Mistry, "The High-k Solution," IEEE Spectrum, Oct 2007, pp. 29-35.
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(2007)
IEEE Spectrum
, pp. 29-35
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Bohr, M.1
Chau, R.2
Ghani, T.3
Mistry, K.4
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3
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35748969089
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Integrated nanoelectronics for the future
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Nov
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R. Chau, B. Doyle, S. Datta, J. Kavalieros and K. Zhang, "Integrated nanoelectronics for the future," Nature Materials, Vol. 6, Nov 2007, pp. 810-812.
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(2007)
Nature Materials
, vol.6
, pp. 810-812
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Chau, R.1
Doyle, B.2
Datta, S.3
Kavalieros, J.4
Zhang, K.5
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4
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57849143039
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T. Ashley, L. Buckle, S. Datta, M.T. Emeny, D.G Hayes, K.P. Hilton, R. Jefferies, T. Martin, T.J. Philips, D.J. Wallis, P.J. Wilding and R. Chau, Heterogeneous InSb quantum well transistors on silicon for ultra-high speed, low power
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T. Ashley, L. Buckle, S. Datta, M.T. Emeny, D.G Hayes, K.P. Hilton, R. Jefferies, T. Martin, T.J. Philips, D.J. Wallis, P.J. Wilding and R. Chau, "Heterogeneous InSb quantum well transistors on silicon for ultra-high speed, low power
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5
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57849099789
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logic applications, Electronics Letters, 43, No. 14, July 2007.
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logic applications," Electronics Letters, Vol. 43, No. 14, July 2007.
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7
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57849118497
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III-V on Silicon for Future High Speed and Ultra-low Power Digital Applications: Challenges and Opportunities
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Digest of Papers, pp
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R. Chau, "III-V on Silicon for Future High Speed and Ultra-low Power Digital Applications: Challenges and Opportunities," CS Mantech Conference 2008, Digest of Papers, pp. 15-18.
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(2008)
CS Mantech Conference
, pp. 15-18
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Chau, R.1
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8
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49149131108
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0.3As Quantum Well Transistor on Silicon Substrate using Thin (≤ 2um) Composite Buffer Architecture for High-Speed and Low-Voltage (0.5V) Logic Applications
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Technical Digest
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0.3As Quantum Well Transistor on Silicon Substrate using Thin (≤ 2um) Composite Buffer Architecture for High-Speed and Low-Voltage (0.5V) Logic Applications," International Electron Devices Meeting (IEDM) Technical Digest, 2007, pp. 625-628.
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(2007)
International Electron Devices Meeting (IEDM)
, pp. 625-628
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Hudait, M.K.1
Dewey, G.2
Datta, S.3
Fastenau, J.M.4
Kavalieros, J.5
Liu, W.K.6
Lubyshev, D.7
Pillarisetty, R.8
Rachmady, W.9
Radosavljevic, M.10
Rakshit, T.11
Chau, R.12
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