Conformal deposition and gap-filling of copper into ultranarrow patterns by supercritical fluid deposition

Applied Physics Express

Volumn 1, Issue 9, 2008, Pages 0970021-0970023

  Momose, Takeshi ^a   Sugiyama, Masakazu ^a   Kondoh, Eiichi ^b   Shimogaki, Yukihiro ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EFFLUENT TREATMENT; INDUSTRIAL WASTE TREATMENT; NUCLEATION; SUPERCRITICAL FLUIDS;

CONFORMAL DEPOSITIONS; CONTINUOUS FILMS; CU FILMS; METALLIZATION; NUCLEATION DENSITIES; SUPERCRITICAL FLUID DEPOSITIONS; SURFACE SATURATIONS; ULTRA-LARGE-SCALE INTEGRATIONS;

COPPER;

EID: 57649098999     PISSN: 18820778     EISSN: 18820786     Source Type: Journal    
DOI: 10.1143/APEX.1.097002     Document Type: Article

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