Laser-acoustic, thermal and mechanical methods for investigations of bond lines

International Journal of Adhesion and Adhesives

Volumn 29, Issue 2, 2009, Pages 210-216

  Jansen, Irene ^a   Schneider, Dieter ^a   Häßler, Rüdiger ^b  

^a FRAUNHOFER INSTITUTE FOR MATERIAL AND BEAM TECHNOLOGY IWS   (Germany)

^b LEIBNIZ INSTITUTE OF POLYMER RESEARCH DRESDEN   (Germany)

Author keywords

Epoxy epoxides; Interphases; Micro thermal analysis; Non destructive testing

Indexed keywords

ABS RESINS; ACOUSTICS; ALUMINUM; CARBON FIBER REINFORCED PLASTICS; CURING; FLUID DYNAMICS; LASERS; LIGHT METALS; METAL ANALYSIS; MICROSCOPIC EXAMINATION; NONDESTRUCTIVE EXAMINATION; RESINS; SURFACE WAVES; THERMOANALYSIS; THERMOELECTRICITY; THICK FILMS; THICKNESS MEASUREMENT;

ACOUSTIC METHODS; ADHERENDS; ALUMINIUM SURFACES; ANALYTICAL TECHNIQUES; BOND LINES; COATED SHEETS; COATING PROCESSES; EPOXY ADHESIVES; EPOXY LAYERS; EPOXY/EPOXIDES; HIGH RESOLUTIONS; INTERPHASE THICKNESSES; INTERPHASES; LOCALIZED THERMAL ANALYSES; MECHANICAL METHODS; MICRO-THERMAL ANALYSIS; NON-DESTRUCTIVE TESTING; RESIN LAYERS; SCANNING PROBES; SMALL REGIONS; SUBSTRATE SURFACES; THERMAL ANALYSIS; YOUNG'S MODULUS;

EPOXY RESINS;

EID: 56249119154     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2008.05.003     Document Type: Article

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