Vibration-induced solder joint failure of a ceramic column grid array (CCGA) package

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1271-1278

  Perkins, Andy ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC COLUMN GRID ARRAY (CCGA) PACKAGES; COEFFICIENT OF THERMAL EXPANSION (CTE); VIBRATION ANALYSIS;

CERAMIC MATERIALS; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NATURAL FREQUENCIES; PLASTICITY; SOLDERED JOINTS; STIFFNESS; THERMAL EXPANSION; VIBRATIONS (MECHANICAL);

CHIP SCALE PACKAGES;

EID: 4544260114     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)

1. Vallamattam, B. K., Stevens, K.K., and Wong, TL., 1994, "Effects of added components on the dynamic modeling of printed circuit boards," ASME Mechancis and materials for Electronic Pacakaging: Volume 2- Thermal and Mechanical Behavior and Modeling, " pgs. 151-160.
2. th Electronic Components Conference, pp. 1-6.
3. Suhir, E. 1997, "Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?, " IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 4, December, 1997, pgs. 513-517.
4. Barker, D.B., Chen, Y.S., and Dasgupta, A., 1993, "Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components," ASME Journal of Electronic Packaging, June 1993, Vol. 115, pgs. 195-200.
5. Steinberg, Dave S., 2001, Preventing Thermal Cycling and Vibration failures in Electronic Equipment, Wiley, New York.
6. Singal, R.K., German, D.J., 1992, "A General Analytical Solution for Free Vibration of Rectangular Plates on Fixed Supprts and with Attached Masses," ASME Journal of Electronic Packaging,June 1992, Vol. 114, pgs. 239-245.
7. Pitarresi, J.M., Celetka, D., Coldwel, R. and Smith, D., 1991, "The Smeared Properties Approach to FE Vibration Modeling of Printed Circuit Cards," ASME Journal of Electronic Packaging, Vol. 113, September, pp. 250-257.
8. J.S. Corbin, 1993, "Finite Element analysis for Solder Ball Connect (SBC) structural design optimization," IBM J.Res.Develop. 37, pp. 585-595, September 1993.
9. Hsu, S.M., Lin, J.C., and Chiang, K.N., 2002, "A Full-Scale 3D Finite Element Analysis for No-underfill Flip Chip Packages," ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, LA, pgs. 1-8.
10. th IEEE Electronics Packaging Technology Conference, December 10-12, Singapore, pgs.107-113.
11. Pitarresi, J.M. and Primavera, A., 1991, "Comparison of Vibration Modeling Techniques for Printed Circuit Cards," ASME Winter Conference, Atlanta, Ga., December 1-6, paper no. 91-WA-EEP-34.
12. Pitarresi, J., Geng, P., Beltman W., and Ling, Y., 2002, "Dynamic Modeling and Measurement of Personal Computer Motherboards," 2002 IEEE Electronic Components and Technology Conference, pgs. 597-603.
13. Yang, Q.J., Pang, H.L.J., Wang, Z.P, Lim, G.H., Yap, F.F., and Lin, R.M., 2000, "Reliability of PBGA Assemblies Under Out-Of-Plane Excitaiotns,' IEEE Transactions of Components and packaging Technologies, VO1. 25, No.2, June 2002, pgs. 293-300.
14. rd, pps, 89-94.
15. Wong, T.E, Reed, B.A., Cohen, H.M., and Chu, D.W., 1999, "Development of BGA Solder Joint Vibration Fatigue Life Prediction Model.\." 1999 IEEE Electronic Components and Technology Conference, pps. 149-154.
16. st Edition.
17. Perkins, A., Sitaraman, S., 2003, "Thermo-Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages" 2003 Proceedings 53rd Electronics Components and Technology Conference, pp. 422-428.
18. Nose, H., Sakane, M., Tsukada, Y.,and Nishimura, H., 2003, "Temperature and Strain Rate Effects on Tensile Strength and Inelastic Consititutive Relationship of Sn-Pb Solders," ASME Journal of Electronic Packaging, March 2003, Vol. 125, pgs. 59-66.
19. Cole, M.S., Jozwiak, J.L., Kastberg, E.J., and Martin, G.B., 2002, "Compressive Load Effects on CCGA Reliability," 2002 SMTA International Conference, Chicago.
20. Cole, M., DeSouse, I., Ingalls, E., Inerrante, M., Jozwiak, J., June, M., Martin, G., Milkovich, C., Ross, J., and Shannon, M., 2001, "The New Millenium for CCGA- Beyond 2000 I/O," Proceedings of 2001 SMTA International, Chicago, pp. 297-306.
21. Cole, M.S., Kastberg, E.J., and Martin, G.B., 1996, "Shock and Vibration Limits for CBGA and CCGA," 1996 SMTA International.
22. Sinha, A., Isaccs, P., and Tofil, T., 1997, "Mechanical Reliability of CCGA Solder Joints," Proceedings of SMTA International, April.