Nanosilver particles-based conductive patterns developed by direct soft imprint lithography

Current Applied Physics

Volumn 9, Issue 1 SUPPL., 2009, Pages

  Choi, J H ^a   Lee, S W ^a   Kim, K D ^a   Choi, D G ^a   Jeong, J H ^a   Lee, E S ^a  

^a Korea Institute of Machine and Materials   (South Korea)

Author keywords

Direct patterning; Silver nanoparticle; UV imprint

Indexed keywords

ABS RESINS; CONDUCTING POLYMERS; NANOIMPRINT LITHOGRAPHY; RESINS; SILICONES;

CONDUCTIVE PATTERNS; CURABLE RESINS; CURRENT TRANSFERS; DIRECT PATTERNING; ELECTRICALLY CONDUCTIVE; ELECTRONIC DEVICE STRUCTURES; HYDROXYETHYL METHACRYLATES; METAL PROCESSES; PHOTO INITIATORS; PROCESS STEPS; RESIN MIXTURES; SILVER NANOPARTICLE; SOFT IMPRINT LITHOGRAPHIES; ULTRA VIOLETS; ULTRAVIOLET CURABLE; UV IMPRINT; UV IMPRINTS;

SILVER;

EID: 55649083089     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2008.08.052     Document Type: Article

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