Influence of upper layer on measuring thermal conductivity of multilayer thin films using differential 3-ω method

Thin Solid Films

Volumn 517, Issue 2, 2008, Pages 933-936

  Shin, Sangwoo ^a   Cho, Han Na ^b   Kim, Beom Seok ^a   Cho, Hyung Hee ^a  

^a Yonsei University   (South Korea)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Apparent thermal conductivity; Differential 3 method; Heat spreading effect; Multilayer thin film; Thermal conductivity

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; FILM PREPARATION; MULTILAYER FILMS; MULTILAYERS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SOLIDS; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY; THICK FILMS; THIN FILM DEVICES; THIN FILMS; TWO DIMENSIONAL;

ANALYTICAL MODELING; ANALYTICAL RESULTS; APPARENT THERMAL CONDUCTIVITY; HEAT SPREADING; HEAT SPREADING EFFECT; INTRINSIC ERRORS; MEASUREMENT METHODS; MEASURING; MULTILAYER THIN FILM; MULTILAYER THIN FILMS; SILICON DIOXIDES; UPPER LAYERS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 55049125453     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.06.090     Document Type: Article

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