A temperature-gradient-induced failure mechanism in metallization under fast thermal cycling

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 3, 2008, Pages 590-599

  Smorodin, Tobias ^a   Wilde, Jürgen ^b   Alpern, Peter ^a   Stecher, Matthias ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Interlayer dielectric (ILD) cracking; Metallization failure; Power cycling; Short circuit; Temperature cycling

Indexed keywords

ABS RESINS; CRACKING (CHEMICAL); DEFORMATION; ELECTRIC FAULT LOCATION;

INTERLAYER DIELECTRIC (ILD) CRACKING; METALLIZATION FAILURE; POWER CYCLING; SHORT CIRCUIT; TEMPERATURE CYCLING;

METALLIZING;

EID: 54949126394     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.2002359     Document Type: Article

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