Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free alloy soldered with copper

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 18, Issue 9, 2008, Pages 1651-1657

  Zhou, Ying Chun ^a   Pan, Qing Lin ^a   Li, Wen Bin ^a   Liang, Wen Jie ^a   He, Yun Bin ^a   Li, Yun Chun ^a   Lu, Cong Ge ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Aging; Intermetallic compound; La; Sn Ag Cu lead free solder; Soldering

Indexed keywords

BRAZING; COPPER; EUTECTICS; LANTHANUM; LANTHANUM ALLOYS; LEAD; LEAD COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TIN; TIN ALLOYS; WELDING;

AGING; AGING CONDITIONS; AGING TIMES; CONTINUOUS; CU SUBSTRATES; EUTECTIC STRUCTURES; GROWTH BEHAVIORS; GROWTH KINETIC; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUNDS; LA; LEAD-FREE; LEAD-FREE SOLDERS; SN-AG-CU; SN-AG-CU LEAD-FREE SOLDER; SUBSTRATE INTERFACES;

INTERMETALLICS;

EID: 54949114768     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. Wang Jian-Xin, Xue Song-Bai, Fang Dian-Song, Ju Jin-Long, Han Zong-Jie, Yao Li-Hua. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad[J]. Trans Nonferrous Met Soc China, 2006, 16(8): 1374-1378.
2. Wu C M L, Yu D Q, Law C M T, Wang L. Properties of lead-free solder alloys with rare earth element additions[J]. Mater Sci Eng R, 2004, 44(1): 1-44.
3. Duan Li-Lei, Yu Da-Quan, Zhao Jie, Wang L. Microstructures of Sn-9Zn-3Bi solder/Cu joint during long-term aging at 170 °C[J]. The Chinese Journal of Nonferrous Metals, 2004, 14(5): 842-847.
4. Vianco P T, Rejent J A, Hlava P F. Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder[J]. Journal of Electronic Materials, 2004, 33(10): 991-1004.
5. Chen Z G, Shi Y W, Xia Z D, Yan Y F. Properties of lead-free solder SnAgCu containing minute amounts of rare earth[J]. Journal of Electronic Materials, 2003, 32(4): 235-243.
6. Law C M T, Wu C M L, Yu D Q, Wang L, Lai J K L. Microstructure, solderability and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys[J]. Journal of Electronic Materials, 2006, 35(1): 89-93.
7. Chen B L, Li G Y. Influence of Sb on IMC growth in Sn-Ag-Cu-Sb Pb-free solder joints in reflow process[J]. Thin Solid Films, 2004, 462/463: 395-401.
8. Lu Bin, Wang Juan-Hui, Li Hui, Zhu Hua-Wei, Jiao Xian-He. Effect of 0.10% Ce on intermetallic compounds at Sn-0.7Cu-0.5Ni/Cu interface[J]. The Chinese Journal of Nonferrous Metals, 2007, 17(2): 390-395
9. Lin C Y, Jao C C, Lee C, Yen Y W. The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates[J]. Journal of Alloys and Compounds, 2007, 440(1/2): 333-340.
10. Kim H K, Tu K N. Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening[J]. Physical Review B, 1996, 53(24): 16027-16034.
11. 3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints[J]. Journal of Electronic Materials, 2003, 32(12): 1403-1413.
12. Rizvi M J, Chan Y C, Bailey C, Lu H, Islam M N. Effect of adding 1 wt% Bi into Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging[J]. Journal of Alloys and Compounds, 2006, 407(1/2): 208-214.
13. Schaefer M, Fournelle R A, Liang J. Theory for intermetallic phase growth between Cu and liquid Sn-Pb based on grain boundary diffusion control. Journal of Electronic Materials, 1998, 27(11): 1167-1176.
14. Ma X, Qian Y Y, Yoshida F. Effect of La on the Sn-rich halo formation in Sn60-Pb40 alloy [J]. Journal of Alloys and Compounds, 2001, 327(1/2): 263-266.
15. Xiao W M, Shi Y W, Lei Y P, Xia Z D, Guo F. Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys [J]. Journal of Electronic Materials, 2006, 35(5): 1095-1103.
16. Lu H Y, Balkan H, Simn Ng K Y. Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects [J]. Journal of Materials Science: Materials in Electronics, 2006, 17(1): 171-178.
17. Li B, Shi Y W, Lei Y P, Guo F, Xia Z D, Zong B. Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint[J]. Journal of Electronic Materials, 2005, 34(3): 217-224.