An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 611-621

  Kanuparthi, Sasanka ^a   Subbarayan, Ganesh ^a   Siegmund, Thomas ^a   Sammakia, Bahgat ^b  

^a PURDUE UNIVERSITY   (United States)

^b State University of New York at Binghamton   (United States)

Author keywords

Full field simulations; Network models; Thermal interface materials

Indexed keywords

ASSOCIATION REACTIONS; CARBON FIBER REINFORCED PLASTICS; COMPUTER PROGRAMMING; FLOW INTERACTIONS; HEAT RESISTANCE; IMAGE SEGMENTATION; INDUSTRIAL ENGINEERING; JAVA PROGRAMMING LANGUAGE; MICROELECTRONICS; NETWORK PROTOCOLS; PARTICLE INTERACTIONS; RANDOM PROCESSES; SENSOR NETWORKS; SILICONES; SILVER; SIZE DISTRIBUTION; TELECOMMUNICATION NETWORKS; THERMAL INSULATING MATERIALS; THERMOELECTRICITY;

APPLICATIONS.; COMPUTATION TIME; COMPUTATIONALLY EXPENSIVE; EFFECTIVE THERMAL CONDUCTIVITY; EPOXY MATRICES; FINITE ELEMENT; FULL-FIELD; FULL-FIELD SIMULATION; FULL-FIELD SIMULATIONS; INTER-PARTICLE INTERACTIONS; INTERFACE MATERIALS; MANUFACTURING PROCESSES; MATERIAL PARTICLES; MESHLESS; MICRO-STRUCTURAL; MODEL SIZE; NETWORK MODELLING; NETWORK MODELS; ORDERS-OF-MAGNITUDE; PARTICULATE COMPOSITES; PARTICULATE SYSTEMS; RANDOM NETWORK MODELS; SILVER PARTICLES; THERMAL INTERFACE MATERIALS; THERMAL TRANSPORT;

FINITE ELEMENT METHOD;

EID: 54849376400     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001839     Document Type: Article

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