Hierarchical modeling and trade-off studies in design of thermal interface materials

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1479-1486

  Zhang, X ^a   Kanuparthi, S ^b   Subbarayan, G ^b   Sammakia, B ^c   Tonapi, S ^a  

^a GE GLOBAL RESEARCH   (United States)

^b PURDUE UNIVERSITY   (United States)

^c BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILLERS; MATHEMATICAL MODELS; MICROSTRUCTURE; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

FILLER MATERIALS; JAVA LANGUAGE FRAMEWORK; THERMAL INTERFACE MATERIALS (TIMS);

POLYMERS;

EID: 32844466434     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73259     Document Type: Conference Paper

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