Full-field simulations of particulate thermal interface materials: Separating the effects of random distribution from interfacial resistance

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1276-1282

  Kanuparthi, S ^a   Zhang, X ^b   Subbarayan, G ^a   Sammakia, B ^c   Gowda, A ^b   Tonapi, S ^b  

^a PURDUE UNIVERSITY   (United States)

^b GE GLOBAL RESEARCH   (United States)

^c BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOOLEAN OPERATIONS; INTERFACIAL RESISTANCE; MATRIX CONDUCTIVITIES; RANDOM DISTRIBUTION;

BOOLEAN FUNCTIONS; COMPUTER SIMULATION; HEAT RESISTANCE; INTERFACES (MATERIALS); MICROSTRUCTURE; PROBABILITY DISTRIBUTIONS; RANDOM PROCESSES;

MATERIALS SCIENCE;

EID: 33845597848     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645492     Document Type: Conference Paper

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