Popcorn cracking in a plastic ball grid array package

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 200-204

  Shioda, T ^a   Tanaka, J ^a   Hagimura, A ^a  

^a MITSUI CHEMICALS INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROELECTRONICS; RIGIDITY; SUBSTRATES;

CRACKING RESISTANCE; DIE-ATTACH; IR REFLOW; PLASTIC BALL GRID ARRAY PACKAGES; PLASTIC BALL GRID ARRAYS;

BALL GRID ARRAYS;

EID: 5444267777     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704621     Document Type: Conference Paper

References (4)

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2. J. Houghten, B. Freyman, I. K. Shim, P. S. Youm, Y. W. Heo, M. E. Lee, "Proceedings of the 1994 IEPS CONFERENCE', pp. 603, 1994.
3. G. Hawkins, G. Ganesan, G. Lewis, H. Berg, "Proceedings of the lntemational Jovmal of Microcircuifs and Electronic Packaging", 18(2), pp. 122, 1995.
4. KShima, K. Asahina, HSakuraba, K. Fujita, J. Tanaka, A. Hagimura, M-Kitahara, "Proceedings of the fechnicai conference, IPC Printed circuits Exm '96", San Jose, ppS4-3-1. 1996.