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1
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0027579438
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A numerical simulation on stress induced failure in aluminum conductor of microelectronic package based on surface and grain boundary diffusion
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Ser. A
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Kitamura, T., Ohtani, R. and Yamanaka, T., A Numerical Simulation on Stress Induced Failure in Aluminum Conductor of Microelectronic Package Based on Surface and Grain Boundary Diffusion, JSME Int. J., Ser. A, Vol.36, No.2 (1993), pp.146-151.
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(1993)
JSME Int. J.
, vol.36
, Issue.2
, pp. 146-151
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Kitamura, T.1
Ohtani, R.2
Yamanaka, T.3
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2
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27744577658
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Modeling solid-state chemistry: Interatomic potentials for multicomponent systems
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Tersoff, J., Modeling Solid-State Chemistry: Interatomic Potentials for Multicomponent Systems, Phys. Rev., B, Vol.39, (1989), pp.5566-5568.
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(1989)
Phys. Rev., B
, vol.39
, pp. 5566-5568
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Tersoff, J.1
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3
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0041491238
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Abraham, F.F., MAADLY Spanning the Length Scales in Dynamic Fracture, CMES, Vol.1, No.4 (2000), pp.63-70.
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(2000)
MAADLY Spanning the Length Scales in Dynamic Fracture, CMES
, vol.1
, Issue.4
, pp. 63-70
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Abraham, F.F.1
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5
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0033878975
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Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials
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Iwasaki, T., Molecular Dynamics Study of Adhesion Strength and Diffusion at Interfaces between Interconnect Materials and Underlay Materials, Computational Mechanics, Vol.25, No.1 (2000), pp.78-86.
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(2000)
Computational Mechanics
, vol.25
, Issue.1
, pp. 78-86
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Iwasaki, T.1
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6
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0035382275
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Molecular dynamics analysis of adhesion strength of interfaces between thin films
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Iwasaki, T. and Miura, H., Molecular Dynamics Analysis of Adhesion Strength of Interfaces between Thin Films, Journal of Materials Research, Vol.16, No.6 (2001), pp.1789-1794.
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(2001)
Journal of Materials Research
, vol.16
, Issue.6
, pp. 1789-1794
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Iwasaki, T.1
Miura, H.2
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7
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0030186143
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2 under atmospheric influence
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Sera A
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2 under Atmospheric Influence, JSME Int. J., Sera A, Vol.39, No.3 (1996), pp.313-320.
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(1996)
JSME Int. J.
, vol.39
, Issue.3
, pp. 313-320
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Yasukawa, A.1
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8
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0037005668
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Ab initio simulation on ideal shear strength of silicon
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Yoshitaka, U. and Kitamura, T., Ab Initio Simulation on Ideal Shear Strength of Silicon, Materials Science and Engineering, B, Vol.88, No.1 (2002), pp.79-84.
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(2002)
Materials Science and Engineering, B
, vol.88
, Issue.1
, pp. 79-84
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Yoshitaka, U.1
Kitamura, T.2
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9
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0037342879
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Validity of effective medium theory for aluminum under tension
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Kitamura, T. and Yoshitaka, U., Validity of Effective Medium Theory for Aluminum under Tension, Modelling and Simulation in Materials Science and Engineering, Vol.11 (2003), pp.127-136.
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(2003)
Modelling and Simulation in Materials Science and Engineering
, vol.11
, pp. 127-136
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Kitamura, T.1
Yoshitaka, U.2
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10
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0242611624
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Internal atomic stress near ∑5 grain boundary in aluminum under tension
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Kitamura, T. and Yoshitaka, U., Internal Atomic Stress near ∑5 Grain Boundary in Aluminum under Tension, Modelling and Simulation in Materials Science and Engineering, Vol.11 (2003), pp.839-849.
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(2003)
Modelling and Simulation in Materials Science and Engineering
, vol.11
, pp. 839-849
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Kitamura, T.1
Yoshitaka, U.2
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11
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5444240579
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Metallic-semiconducting transition of single-walled carbon nanotubes under high axial strain
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to be published
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Yoshitaka, U., Kitamura, T. and Kushima, A., Metallic-Semiconducting Transition of Single-Walled Carbon Nanotubes under High Axial Strain, Comp. Mater. Sci., to be published.
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Comp. Mater. Sci.
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Yoshitaka, U.1
Kitamura, T.2
Kushima, A.3
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12
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0031209071
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Theoretical tensile stress in tungsten single crystals by full-potential first-principles calculations
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Sob, M., Wang, L.G. and Vitek, V., Theoretical Tensile Stress in Tungsten Single Crystals by Full-Potential First-Principles Calculations, Mater. Sci. Eng., Vol.A234-236 (1997), pp.1075-1078.
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(1997)
Mater. Sci. Eng.
, vol.A234-236
, pp. 1075-1078
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Sob, M.1
Wang, L.G.2
Vitek, V.3
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13
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0031146506
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Local stability of higher-energy phases in metallic materials and its relation to the structure of extended defects
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Sob, M., Wang, L.G. and Vitek, V., Local Stability of Higher-Energy Phases in Metallic Materials and Its Relation to the Structure of Extended Defects, Comput. Mat. Sci., Vol.8 (1997), pp.100-106.
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(1997)
Comput. Mat. Sci.
, vol.8
, pp. 100-106
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Sob, M.1
Wang, L.G.2
Vitek, V.3
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14
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0041841214
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Effect of residual stress on delamination from interface edge between nano-films
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Kitamura, T., Hirakata, H. and Istuji, T., Effect of Residual Stress on Delamination from Interface Edge between Nano-Films, Engineering Fracture Mechanics, Vol.70 (2003), pp.2089-2101.
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(2003)
Engineering Fracture Mechanics
, vol.70
, pp. 2089-2101
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Kitamura, T.1
Hirakata, H.2
Istuji, T.3
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15
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3042595461
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Applicability of fracture mechanics on brittle delamination of nanoscale film edge
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to be published
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Kitamura, T., Hirakata, H. and Satake, Y., Applicability of Fracture Mechanics on Brittle Delamination of Nanoscale Film Edge, JSME Int. J. Ser. A, to be published.
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JSME Int. J. Ser. A
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Kitamura, T.1
Hirakata, H.2
Satake, Y.3
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16
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2142714502
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Evaluation of interface strength of micro-dot on substrate by means of AFM
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to be published
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Hirakata, H., Kitamura, T. and Yamamoto, Y., Evaluation of Interface Strength of Micro-Dot on Substrate by means of AFM, International Journal of Solids and Structures, to be published.
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International Journal of Solids and Structures
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Hirakata, H.1
Kitamura, T.2
Yamamoto, Y.3
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17
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5444244094
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Japan Chemical Society, Maruzen
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Japan Chemical Society, Chemical Handbook, Fundamentals, Section II, (1966), p.819, Maruzen.
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(1966)
Chemical Handbook, Fundamentals, Section II
, pp. 819
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