Ferrite and copper electroless plating of photopolymerized resin for micromolding of three-dimensional structures

Japanese Journal of Applied Physics

Volumn 47, Issue 4 PART 2, 2008, Pages 3232-3235

  Mukai, Kohki ^a   Kitayama, Shinya ^a   Yoshimura, Toshiya ^a   Maruo, Shoji ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

Copper; Electroless plating; Ferrite; Micromachine; Mold; Photopolymerization

Indexed keywords

ABS RESINS; CLARIFICATION; COPPER; ELECTROLESS PLATING; FERRITE; MICROMACHINING; MOLDS; PHOTOPOLYMERIZATION; PLATING; THREE DIMENSIONAL;

DIMENSIONAL STRUCTURES; HIGH-RESOLUTION; MICROFABRICATION PROCESSES; MICROMACHINE; MICROMOLDING; OPTICAL MICROSCOPES; SUBMICRON RESOLUTIONS; X-RAY DIFFRACTIONS; X-RAY FLUORESCENCES;

RESINS;

EID: 54249124971     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.3232     Document Type: Article

References (9)

1. S. Maruo and S. Kawata: J. Microelectromech. Syst. 7 (1998) 411.
2. L. Wu, Y. Zhong, C. T. Chan, K. S. Wong, and G. P. Wang: Appl. Phys. Lett. 86 (2005) 241102.
3. S. Kawata, H.-B. Sun, T. Tanaka, and K. Takada: Nature 412 (2001) 697.
4. K. Nishimura, H. Uchida, M. Inoue, M. Sendoh, K. Ishiyama, and K. I. Arai: J. Appl. Phys. 93 (2003) 6712.
5. F. Formanek, N. Takeyasu, T. Tanaka, K. Chiyoda, A. Ishikawa, and S. Kawata: Appl. Phys. Lett. 88 (2006) 083110.
6. T. Tanaka, A. Ishikawa, and S. Kawata: Appl. Phys. Lett. 88 (2006) 081107.
7. K. Mukai, S. Maruo, and T. Yoshimura: Jpn. J. Appl. Phys. 46 (2007) 2761.
8. K. Mukai, T. Yoshimura, S. Kitayama, and S. Maruo: J. Photopolym. Sci. Technol. 20 (2007) 285.
9. M. Abe, Y. Tamaura, and T. Itoh: Thin Solid Films 216 (1992) 155.