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Volumn 20, Issue 2, 2007, Pages 285-290

Electroless and electrolytic plating of photopolymerized resin for use in the micro-molding of three-dimensional nickel structures

Author keywords

Electroless plating; Electrolytic plating; Microstructure; Molding; Nickel; Photopolymerization

Indexed keywords


EID: 34548623936     PISSN: 09149244     EISSN: 13496336     Source Type: Journal    
DOI: 10.2494/photopolymer.20.285     Document Type: Article
Times cited : (6)

References (8)
  • 6
    • 34548605324 scopus 로고    scopus 로고
    • T. Yoshimura, S. Maruo, and K. Mukai, Ext. Abs. Int. Conf. Solid State Devices and Materials 2006 (Yokohama, Japan).
    • T. Yoshimura, S. Maruo, and K. Mukai, Ext. Abs. Int. Conf. Solid State Devices and Materials 2006 (Yokohama, Japan).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.