Embedded decoupling capacitors up to 80 nF on multichip module-deposited with quasi-three-dimensional metal-insulator-metal structure

Japanese Journal of Applied Physics

Volumn 47, Issue 4 PART 2, 2008, Pages 2535-2537

  Maeng, Jimin ^a   Song, Sangsub ^a   Jeon, Namcheol ^a   Yoo, Chan Sei ^a   Lee, Heeseok ^a   Seo, Kwangseok ^a  

^a Seoul National University   (South Korea)

Author keywords

Decoupling; Embedded capacitor; MCM D; MIM; SOP; Thin film

Indexed keywords

CAPACITORS; COST EFFECTIVENESS; DIELECTRIC DEVICES; ELECTRIC EQUIPMENT; ETCHING; METAL INSULATOR BOUNDARIES; METALS; MIM DEVICES; MODEMS; MULTICHIP MODULES; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR INSULATOR BOUNDARIES; SILICON; STRUCTURAL METALS; SWITCHING SYSTEMS; THICK FILMS; THIN FILM DEVICES; THREE DIMENSIONAL; WET ETCHING; ZEOLITES;

DECOUPLING; EMBEDDED CAPACITOR; MCM-D; MIM; SOP;

CAPACITANCE;

EID: 54249120022     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.2535     Document Type: Article

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