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Volumn 120, Issue 4, 1998, Pages 360-366

A new approach to calculate atomic flux divergence by electromigration

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC CURRENT DISTRIBUTION; ELECTROMIGRATION; POLYCRYSTALLINE MATERIALS; TEMPERATURE DISTRIBUTION;

EID: 0032292876     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792647     Document Type: Article
Times cited : (49)

References (12)
  • 1
    • 0015142191 scopus 로고
    • Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin-Film Conductors
    • Attardo, M. J., Rutledge, R., and Jack, R. C., 1971, “Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin-Film Conductors,”Journal of Applied Physics, Vol. 42, No. 11, pp. 4343-4349.
    • (1971) Journal of Applied Physics , vol.42 , Issue.11 , pp. 4343-4349
    • Attardo, M.J.1    Rutledge, R.2    Jack, R.C.3
  • 2
  • 4
    • 0003354983 scopus 로고
    • Atomistic and Computer Modeling of Metallization Failure of Integrated Circuits by Electromigration
    • Kirchheim, R., and Kaeber, U., 1991, “Atomistic and Computer Modeling of Metallization Failure of Integrated Circuits by Electromigration,”Journal of Applied Physics, Vol. 70, No. 1, pp. 172-181.
    • (1991) Journal of Applied Physics , vol.70 , Issue.1 , pp. 172-181
    • Kirchheim, R.1    Kaeber, U.2
  • 5
    • 0023849056 scopus 로고
    • Kinetic Study of Electromigration Failure in Cr/Al-Cu Thin Film Conductors Covered with Polyimide and the Problem of the Stress Dependant Activation Energy
    • Lloyd, J. R., Shatzkes, M., and Challener, D. C., 1988, “Kinetic Study of Electromigration Failure in Cr/Al-Cu Thin Film Conductors Covered with Polyimide and the Problem of the Stress Dependant Activation Energy,”Proceedings of the IEEE International Reliability Physics Symposium, pp. 216-225.
    • (1988) Proceedings of the IEEE International Reliability Physics Symposium , pp. 216-225
    • Lloyd, J.R.1    Shatzkes, M.2    Challener, D.C.3
  • 7
    • 0000204618 scopus 로고
    • Resistance Monitoring and Effects of Nonadhesion During Electromigration in Aluminum Films
    • Rosenberg, R., and Berenbaum, L., 1968, “Resistance Monitoring and Effects of Nonadhesion During Electromigration in Aluminum Films,”Applied Physics Letters, Vol. 12, No. 5, pp. 201-204.
    • (1968) Applied Physics Letters , vol.12 , Issue.5 , pp. 201-204
    • Rosenberg, R.1    Berenbaum, L.2
  • 8
    • 58149209837 scopus 로고
    • Current Density and Temperature Distributions Near the Corner of Angled Metal Line
    • Sasagawa, K., Saka, M., and Abé, H., 1995, “Current Density and Temperature Distributions Near the Corner of Angled Metal Line,'’Mechanics Research Communications, Vol. 22, No. 5, pp. 473-483.
    • (1995) Mechanics Research Communications , vol.22 , Issue.5 , pp. 473-483
    • Sasagawa, K.1    Saka, M.2    Abé, H.3
  • 11
    • 0000590312 scopus 로고
    • Nuclear Relaxation in Aluminum
    • Spokas, J. J., and Slichter, C. P., 1959, “Nuclear Relaxation in Aluminum,”Physical Review, Vol. 113, No. 6, pp. 1462-1472.
    • (1959) Physical Review , vol.113 , Issue.6 , pp. 1462-1472
    • Spokas, J.J.1    Slichter, C.P.2
  • 12
    • 0000323896 scopus 로고
    • Linewidth Dependence of Electromigration in Evaporated Al-0.5%Cu
    • Vaidya, S., Sheng, T. T., and Sinha, A. K., 1980, “Linewidth Dependence of Electromigration in Evaporated Al-0.5%Cu,”Applied Physics Letters, Vol. 36, No. 5, pp. 464-466.
    • (1980) Applied Physics Letters , vol.36 , Issue.5 , pp. 464-466
    • Vaidya, S.1    Sheng, T.T.2    Sinha, A.K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.