The effects of Ca and Pd dopants on gold bonding wire and gold rod

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 351-356

  Saraswati, T S ^a,c   Sritharan, T ^a   Pang, C I ^a   Chew, Y H ^a   Breach, C D ^b   Wulff, F ^b   Mhaisalkar, S G ^a   Wong, C C ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Materials and Applications Centre   (Singapore)

^c Kulicke and Soffa SEA Pte Ltd   (Singapore)

Author keywords

Depth sensing indentation; Gold bonding wire; TEM; X ray stress analysis

Indexed keywords

DEPTH SENSING NANO-INDENTATION (DSI); DOPANTS; PHYSIOCHEMICAL EFFECTS;

CALCIUM; CHEMICAL BONDS; DOPING (ADDITIVES); INDENTATION; PALLADIUM; WIRE; X RAY DIFFRACTION ANALYSIS;

GOLD;

EID: 4344564968     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.032     Document Type: Article

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