Thermocouples from electrodeposited submicrometer wires prepared by electrochemical step edge decoration

Chemistry of Materials

Volumn 20, Issue 17, 2008, Pages 5464-5474

  Bourg, M E ^a   Van Der Veer, W E ^a   Guell A G ^b   Penner, R M ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSITY OF BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL STEP-EDGE DECORATION; MEASURING TEMPERATURE; METAL THIN FILMS; METAL WIRES; NICKEL WIRES; OUTPUT VOLTAGES; SILVER WIRES; SUB MICROMETERS; SUBMICROMETER WIRES;

COPPER PLATING; CORROSION; ELECTRODEPOSITION; FILM PREPARATION; LASER APPLICATIONS; METALLIZING; METALS; NANOSTRUCTURED MATERIALS; NICKEL; NICKEL ALLOYS; SILVER; THERMAL EFFECTS; THERMOCOUPLES; THERMOMETERS; THICK FILMS;

WIRE;

EID: 52649112146     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm800582p     Document Type: Article

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