Investigation into the roles of sulfur-containing amino acids in electroless nickel plating bath

Industrial and Engineering Chemistry Research

Volumn 47, Issue 17, 2008, Pages 6517-6524

  Wang, Ke ^a   Hong, Liang ^a,b   Liu, Zhao Lin ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDS; AMINATION; AMINES; AMINO ACIDS; ARSENIC COMPOUNDS; CHLORINE COMPOUNDS; CONCENTRATION (PROCESS); ELECTROLESS PLATING; ELECTROPLATING; NICKEL; NICKEL ALLOYS; ORGANIC ACIDS; ORGANOMETALLICS; SULFUR;

ELECTROLESS NICKEL PLATING; ELECTROLESS NICKEL PLATING BATH; LEAD (II);

NICKEL PLATING;

EID: 51849146474     PISSN: 08885885     EISSN: None     Source Type: Journal    
DOI: 10.1021/ie800456b     Document Type: Conference Paper

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