Advanced Drive Systems

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 6, Issue , 2004, Pages 4499-4502

  Tursky, W ^a   Beckedahl, P ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC MEASURING BRIDGES; ELECTRIC POTENTIAL; ELECTRICAL ENGINEERING; INDUCTANCE; INTEGRATING CIRCUITS; POWER CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; SWITCHING CIRCUITS;

AC CONVERSION SYSTEM; ADVANCED DRIVE SYSTEM; BUS INTERFACE; CONTROLLER HARDWARE;

POWER CONVERTERS;

EID: 8744230028     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. K. Stengert, C. Göbi, "Intelligent Integrated Power for low power applications", Proc. EPE'97 p. 3.109 - 3.112, Trondheim 1997
2. W. Tursky, "Devices and their Packaging Technology", Proc. FEPPCON IV, session 1, Salina 2001
3. K. Backhaus, "Trends in Power Semiconductor Packaging Technology", PCIM Europe Issue 6/1999, p. 14 - 18
4. K. Backhaus, "Intelligent power module family SKiiP PACK 3rd generation", PCIM Europe 8/9 2000, p. 10 - 14
5. C.Göbi, H. Leibold, K. Backhaus, T. Stockmeier, "SKiiP 3", Proc. PCIM '01, PC10.6, p. 313 - 318, Nürnberg 2001
6. T. Stockmeier, "Power Semiconductor Packaging - A Problem or a Resource? From the State of the Art to Future Trends", Proc. PCIM '00, PC7.2, p. 195 - 205, Nürnberg 2000
7. Uwe Scheuermann, "Reliability of Pressure Contacted Intelligent Integrated Power Modules", Proc. of ISPSD 2002, pp. 249 - 252, SantaFe, 2002
8. Uwe Scheuermann, Uta Hecht, "Power Cycling Lifetime of Advanced Power Modules for Different Temperature Swings", Proc. of PCIM 2002, pp. 59 - 64, Nuremberg, 2002