Reliability of pressure contacted intelligent integrated power modules

IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Volumn , Issue , 2002, Pages 249-252

  Scheuermann, Uwe ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

IGBT module; IPM; Packaging; Reliability

Indexed keywords

CONTACT SENSORS; COOLING SYSTEMS; CREEP; CURRENT DENSITY; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT SINKS; INSULATED GATE BIPOLAR TRANSISTORS; INTEGRATED CIRCUIT TESTING; INTERCONNECTION NETWORKS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR JUNCTIONS; SOLDERED JOINTS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

INTEGRATED POWER MODULES (IPM);

POWER INTEGRATED CIRCUITS;

EID: 0036049561     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. A modelling approach to assess the creep behaviour of large-area solder joints
2. Further improvements in the reliability of IGBT modules
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4. LoPak IGBT modules - Inverter reliability benefits
5. A novel power module design and technology for improved power cycling capability
6. Fast power cycling test for IGBT modules in traction application