Novel high power semiconductor module for trench IGBTs

IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Volumn 16, Issue , 2004, Pages 343-346

  Stockmeier, Thomas ^a   Manz, Yvonne ^a   Steger, Jürgen ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HEATING; MICROPROCESSOR CHIPS; OSCILLATIONS; POWER GENERATION; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICES; SWITCHING;

AUXILIARY CONTACT TECHNOLOGY; MECHANICAL CONSTRICTIONS; VAPOR PHASE SOLDERING; WEDGE BONDING;

INSULATED GATE BIPOLAR TRANSISTORS;

EID: 4944256245     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/wct.2004.240148     Document Type: Conference Paper

References (7)

1. /1/ M. Pfeffenlehner, T. Laska, R. Mallwitz, A. Mauder, E. Pfirsch, C. Schaeffer "1700V-IGBT3: Field Stop Technology with Optimized Trench Structure - Trend setting for the High Power Applications in Industry and Traction" Proc. ISPSD 02, pp. 105, Cambridge, 2002
2. /2/ K. Nakamura, S. Kusunoki, H. Nakamura, Y. Ishimura, Y. Tomomatsu, T. Minato "Advanced Wide Cell Pitch CSTBTs Having Light Punch-Through (LPT) Structures" Proc. ISPSD 02, pp. 277, Cambride, 2002
3. /3/ K. Häupl, B. König "CAL HD - An Optimized Freewheeling Diode for Trench-IGBT Modules" Proc. PCIM 2002, pp. 439, Nuremberg, 2002
4. st Century" Proc. PCIM 1999, pp. 35, Nuremberg, 1999
5. /5/ R. Heubeck "Low Profile - High Power - Less Parts to Handle: SKiM - A New Industrial Standard IGBT Module in SKiiP Technology" PCIM Europe, July 200
6. /6/ M. Loddenkötter, M. Münzer, J. Thurau "Econopack+: The Standard Platform for Modular Inverter Design" Proc. PCIM2000, pp. 53, Nuremberg, 2000
7. /7/ SEMIKRON Elektronik GmbH, Ascon Systemtechnik-Elektronik GmbH "Dampfphasenvakuumlötanlage" German Patent DE 199 11 887.6