Recent developments of direct bonded copper (DBC) substrates for power modules

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 491-496

  Schulz Harder, J ^a   Exel, K ^a  

^a Curamik Electronics GmbH   (Germany)

Author keywords

Adhesives; Aluminum nitride; Bonding; Ceramics; Copper; Multichip modules; Printed circuits; Silicon; Thermal expansion; Thermal resistance

Indexed keywords

ADHESIVES; ALUMINA; ALUMINUM; ALUMINUM NITRIDE; BONDING; CHIP SCALE PACKAGES; COPPER; ELECTRIC POWER SYSTEMS; ELECTRONICS PACKAGING; HEAT RESISTANCE; MULTICHIP MODULES; NITRIDES; PRINTED CIRCUITS; SILICON; THERMAL EXPANSION;

CERAMICS; DIRECT BONDED COPPERS; HERMETIC PACKAGES; LIQUID COOLING; TEMPERATURE CYCLING; THERMAL EXPANSION COEFFICIENTS; THERMAL PERFORMANCE; VIA TECHNOLOGIES;

CERAMIC MATERIALS;

EID: 84946408942     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298787     Document Type: Conference Paper

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