Post-bond compression process for bonding thin-die on BT substrate using thermoplastic adhesive tape

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2005, Pages

  Chong, Arthur C M ^a   Cheung, Y M ^a  

^a ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CHEMICAL BONDS; FINITE ELEMENT METHOD; SUBSTRATES;

DIE BONDING PARAMETERS; FINITE ELEMENT MODEL;

THERMOPLASTICS;

EID: 42749102992     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251370     Document Type: Conference Paper

References (2)

1. Karnezos M. "Stacked-die packaging technology toolbox" Advanced Packaging, Aug. 2004, pp.41-44.
2. Cheung Y.M. and Chong, A.C.M., "New proposed adhesive application mechanism for stacking die applications", The Fifth International Conference on Electronic Packaging Technology (ICEPT 2003). 2003.