SCOPUS 정보 검색 플랫폼

Volumn , Issue 20, 2001, Pages 83-88

Adhesive properties of ultraviolet curable pressure-sensitive adhesive tape for semiconductor processing (I) - Interpretation via rheological viewpoint

(3) Ozawa, Takehiro a Ishiwata, Shinichi b Kano, Yoshihisa a

a Polymer Engineering Center (Japan)

b Tape Development Department (AT) (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

PRESSURE SENSITIVE ADHESIVE (PSA) TAPES;

ADHESIVES; COPOLYMERIZATION; COPOLYMERS; DEFORMATION; ELASTIC MODULI; GLASS TRANSITION; OLIGOMERS; PEELING; POLYMER BLENDS; RHEOLOGY; SEMICONDUCTOR DEVICE MANUFACTURE; ULTRAVIOLET RADIATION;

ELECTRIC TAPES;

EID: 0035307204 PISSN: 09119280 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.